规格书 |
5-1542008-2 Drawing |
文档 |
5-1542008-2 Statement of Compliance RoHS 2 Statement |
Rohs | Lead free / RoHS Compliant |
RoHS信息 | 5-1542008-2 Statement of Compliance |
标准包装 | 250 |
类型 | Passive |
冷却装置 | BGA |
固定方法 | Clip |
产品高度 | 19.98 mm |
散热片样式 | Radial |
表面处理 | Black Anodized |
材质 | Aluminum |
标准包装 | Trays |
RoHS | RoHS Compliant |
工厂包装数量 | 50 |
评论 | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
RoHSELV合规性 | RoHS compliant, ELV compliant |
Lead Free Solder Processes | Not relevant for lead free process |
高(毫米( ) ) | 19.98 [0.787] |
直径(毫米) | 38.10 [1.500] |
包装尺寸(毫米( ) ) | 29 [1.142] |
设备类型 | BGA |
可燃性等级 | UL 94V-0 |
散热器类型 | 6 Fin Radial |
适用于 | BGA Semiconductor Packages |
行 | ChipCoolers |
产品类型 | Heat Sink |
RoHSELV符合记录 | Converted to comply with RoHS directive |
子类别 | Heat Sink |
交货期 | 49 Days |
系列 | * |
RoHS指令 | Lead free / RoHS Compliant |
标准包装 | 25 |
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